LED lighting High power LED packaging

High-power LED package structure and process due to the complex and directly affect the use of LED performance and life
Abstract

In this paper, optical, thermal, electrical, reliability, etc., a detailed review of high-power white LED packaging design and research advances, and high-power LED package, key technologies have been reviewed. LED package design should be submitted with the chip design at the same time, and the need to light, heat, electricity and uniform consideration of the performance structure. In the packaging process, although the material (thermal substrate, phosphor, potting) selection is important, but the package structure should be to minimize thermal and optical interfaces, thereby reducing the package thermal resistance, improve the efficiency of a light. Finally, the paper LED lighting design and packaging requirements are described.

Key words: solid-state white LED lighting High power LED packaging

I. Introduction

High-power LED package structure and process due to the complex and directly affect the use of LED performance and life has been a research hotspot in recent years, especially in high-power white LED package is research hotspot in the hot spots. LED package features include: 1. Mechanical protection to improve reliability; 2. To enhance heat dissipation to reduce the chip junction temperature to improve LED performance; 3. Optical control and improve the efficiency of a light, optimizing the beam distribution; 4. Power Management , including AC / DC shift and power control.

LED packaging methods, materials, structures and processes mainly by the choice of chip architecture, optical / mechanical properties, specific application and cost factors. After 40 years of development, LED package has gone through the rack (Lamp LED), Chip (SMD LED), power type LED (Power LED) and other stages of development. With the chip power increases, especially in the development of solid-state lighting technology, the demand for LED encapsulation of optical, thermal, electrical and mechanical structures put forward new and higher requirements. In order to effectively reduce the package thermal resistance, improve the efficiency of a light, we must adopt a new technical ideas to carry out package design.

Second, the key to high-power LED packaging technology

High-power LED package, mainly related to light, heat, electricity, structure and process in such areas as shown in Figure 1. These factors not only with each other independent of each other, but also affect each other. Among them, the purpose of just LED packaging, heat is the key, power, structure and process is the means, but the level of performance is a concrete manifestation of packaging. From the process in terms of compatibility and reduce production cost, LED packaging design should be with the chip design at the same time that the chip design should take into account when packaging structure and process. Otherwise, the other chip manufacturing is completed, may be due to the need for chip packaging structure adjustment, thereby prolonging the product development cycle and process costs, and sometimes even impossible.

LED lighting High power LED packaging