Of various forms of LED packaging structure and technology
LED is a kind of energy can be directly converted into visible light and radiation-emitting devices with low voltage, power consumption is small, light-emitting efficiency, light-emitting response time very short, light color purity, structure, solid, impact resistance, vibration, stable and reliable, light weight, small size, low cost range of features, have developed rapidly and is now able to mass production of the entire visible spectral colors of high-brightness, high-performance products. Domestic red, green, orange, yellow LED output of about 12% of the world's total, "15" period the industry goal is to achieve an annual output capacity of 30 billion to achieve ultra-high brightness of the LED epitaxial films and AiGslnP chips large-scale production, annual output of more than one billion red, orange, yellow high-brightness LED die, breaking the GaN materials, key technologies to achieve blue, green, white LED's in mass production. It is predicted that by 2005 the international market demand for LED is about 200 billion, with sales of 800 billion dollars.
Link in the LED industry, the upstream is the LED chip substrate and the substrate production, midstream industry into the design and manufacture of LED chip production, downstream packaging and testing go LED, R & D low thermal resistance, excellent optical properties, high reliability and packaging technology is new type of LED toward practical and market-oriented industrialization only way, in a sense is a link to industry and market, bonds, only the package in order to become a good end product can be put into practical application, in order to provide customers with services to enable chain interlocking, seamless flow. LED packaging specificity LED packaging technology, mostly in the discrete devices on the basis of the development and packaging technology evolved, but there are important differences.
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