Domestic semiconductor lighting chip technology

National semiconductor lighting chip technology Development Status

Domestic semiconductor lighting-chip technology is relatively late start abroad, level of technology from the international leader in the industry there is a certain distance. However, in recent years in the guidance and support of relevant government departments, domestic lighting-class LED chip technology research, development and industrialization has made considerable progress. Particularly in the "15" national research programs, "the semiconductor lighting industrial technology development" projects and "Eleventh Five-Year" 863 Program semiconductor lighting project under the guidance of major domestic manufacturers of LED chip, as well as research institutes to rely on the strength of their great efforts to put on the power of lighting-class LED chip technology development, technology ladder, and the gradual deepening of industrialization process, and gradually narrow the gap between the world's leading industry achieved a series of encouraging results. During this period experienced the "epitaxial wafers from outsourcing to the self-control, chip architecture from being loaded into the flip-chip and then to dress, the light effect from 30lm / W to 60lm / W and then to 100lm / W" course of development.

At present, the domestic power of lighting-class LED chip products in the optical efficiency, performance, life and reliability have made great progress to develop a graphics substrate, transparent electrode and all-round mirror and a series of key process technology. Industrialization of, to an optoelectronic three domestic manufacturers, represented a breakthrough of 100lm / W's technical mark the successful completion of 863 subject objectives. Figure 1 shows the domestic upstream manufacturers introduced a variety of appearance of power type LED chip, chip architecture used in all technology is more mature and produce a lower cost structure is being installed. Domestic chip is expected by virtue of superior performance and competitive price advantage in the "10 City, 10000" pilot demonstration projects, large-size LCD display backlight and indoor general lighting applications, and gradually infiltrate and eventually replace the imported chips, promote China's semiconductor Lighting the healthy development of the whole industrial chain, and to grow.

3 An optoelectronic As the LED industry, the upper reaches of the leading enterprises attach great importance to technological innovation, in support of relevant government departments, increase lighting on-chip development and research efforts. 3 An optical at different times, for the study of hot spots and trends, combined with their own needs and industrial base, develop different characteristics of power type LED chip products (shown in Figure 2). "Tenth Five-Year" period of national research programs, three security to develop bi-directional zener-based flip-chip structure of silicon-based chip, board; "Eleventh Five-Year" period, the three security has developed a graphics-based substrate, a full range of technologies such as mirror Formal structure chip product, the product package, a maximum luminous efficiency white light devices of up to 105lm / W, it can be said is the currently the highest possible level. GaN thin-film structure, an optoelectronic chip is the next three R & D focus, Saman has completed the initial vertical thin-film chip sample trial and testing optical efficiency of up to 90lm / W. The future, three from an optical thin-film GaN epitaxial chip structure design; permanent substrate selection and binding process; growth substrate, stripping process; reflex P electrode system design and production processes; N-polar surface N -type ohmic contact manufacturing process; a light surface roughening process; photonic crystal thin-film chip technology in the application of seven-pronged, the research 150lm / W lighting-class thin-film GaN LED chip technology and strive to realize industrialization.